Method for constructing multilayer circuit boards having air bridges
US6475703B2 · kind B2 · utility
5Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1998 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Dec 1, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0376
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.