Piezoelectric device with sealed vibration space and manufacturing method thereof
US6475823B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Jun 2, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The invention is directed to piezoelectric device having a vibration space that achieves a high degree of airtightness which is not readily reduced, and a manufacturing method thereof. First and second hollow layers are formed at first and second surfaces of a piezoelectric substrate to form first and second cavities around first and second electrodes respectively. The first and second cavities each have a uniform width and extend between a first surface and an opposing second surface of the first and second hollow layers respectively, around vibration portions of the piezoelectric element. First and second sealing layers are each formed on the second surface of the first and second hollow layers to seal the first and second cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.