Selective deposition modeling material
US6476122B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1999 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Jun 16, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L91/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a selective deposition modeling material containing a base material, a plasticizing component containing at least 10% by weight of at least one plasticizing agent that is solid at ambient conditions, and at least one tackifying resin that is compatible with the base material and the plasticizing component, wherein the modeling material has a viscosity of less than about 30 centipoise at 130° C. The selective deposition modeling material can alternatively contain about 52% to 98% of a reactive polymeric material that is a mixture of at least one compound containing at least one glycidyl group per molecule, at least one compound having at least one terminal unsaturated group per molecule, at least one compound having at least one vinyl ether group per molecule or mixtures thereof; and a cure agent or activator; and optionally a non-reactive polymeric material or wax material, wherein the modeling material contains a fast set inducing segment content of about 10% to 70% by weight. The present invention further relates to a method for producing a three-dimensional article using said modeling materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.