Patent · US Expired

Wafer scale processing

US6476415B1 · kind B1 · utility

17Cited by

4References

41Claims

0Family size

Assignee

THREE-FIVE SYSTEMS, INC. · US

Inventors

Tobias Walker · Rötteln, DE
Douglas J. McKnight · Boulder, US
Kam Kwong Raymond Wan · Tuen Mun, CN

Key dates

Filing date	Jul 20, 2000
Grant date	Nov 5, 2002
Priority date	—
Expiry date	Jul 20, 2020

Classification

Technology area (CPC G)Physics
CPC primaryG02F1/136277
WIPO fieldOptics
WIPO sectorInstruments

Abstract

This invention relates to a method of fabricating a light modulation system having a semiconductor substrate. In one exemplary method, an optical layer is applied over a semiconductor substrate which includes a plurality of integrated circuits. Each of these integrated circuits is capable of creating a separate display device. A protective layer is then applied over the optical layer. The plurality of integrated circuits is then singulated. Various other embodiments of apparatuses and methods are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.