Image forming substrate having lead wiring connected to a conductive terminal
US6476547B1 · kind B1 · utility
19Cited by
5References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 3, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Mar 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2211/46
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An image forming substrate includes an image forming member, and a lead wiring extending to a corner of the image forming substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.