Tilt-away processor retention module with hold-down screw device
US6477050B1 · kind B1 · utility
14Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2001 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Sep 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fastening mechanism for installing a processor heatsink on a planar board space takes up a minimal amount of the planar board space. The heatsink is held down securely against the top of the processor with a substantial amount of force. This is accomplished through a screw and leaf spring mechanism at each side edge of the processor. The screw and leaf spring arrangement are rotated out of the way while the heatsink is installed and then returned to their original positions to retain the heatsink. The mechanism is partially assembled prior to the installation of the heatsink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.