Socket activation interlock
US6477051B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 2001 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4871
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, when the component has a heat dissipation device attached to a substrate. A first embodiment of the invention involves a method to assemble a component and a heat dissipation and/or attachment device to a socket on a substrate using an activation interlock. A second embodiment of the invention involves a method to disassemble a component and a heat dissipation and/or attachment device from a socket on a substrate using an activation interlock. A third embodiment of the invention involves an assembled substrate with an activation interlock to limit operator ability to open and close a socket holding a component relative to the engagement and disengagement of a heat dissipation and/or attachment device attached to the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.