Polishing pad
US6477926B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2000 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Nov 9, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad is described as comprising, (a) particulate polymer selected from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) crosslinked organic polymer binder (e.g., crosslinked polyurethane binder and/or crosslinked polyepoxide binder), which binds the particulate polymer together. The particulate polymer and crosslinked organic polymer binder are distributed substantially uniformly throughout the polishing pad, and the pad has a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad. Polishing pad assemblies are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.