Patent · US Expired

Method and device for full thickness resectioning of an organ

US6478210B2 · kind B2 · utility

1,865Cited by
9References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 23, 2002
Grant dateNov 12, 2002
Priority date
Expiry dateJan 23, 2022

Classification

  • Technology area (CPC A)Human Necessities
  • CPC primaryA61B2090/306
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

A full-thickness resection system comprises a flexible endoscope and a stapling mechanism, wherein the endoscope is slidably received through at least a portion of the stapling mechanism. The stapling mechanism comprises an anvil and a stapling head mounted to the anvil so that the anvil and the stapling head are moveable with respect to one another between a tissue receiving position and a stapling position and wherein a gap formed between the stapling head and the anvil is larger in the tissue receiving position than it is in the stapling position. A position adjusting mechanism is provided for moving the anvil and the stapling head between the tissue receiving and stapling positions and a staple firing mechanism sequentially fires a plurality of staples from the stapling head across the gap against the anvil and through any tissue received in the gap and a knife cuts a portion of tissue received within the gap. A control unit which remains outside the body is coupled to the stapling mechanism for controlling operation of the position adjusting mechanism and the staple firing mechanism.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.