Wafer orienting and reading mechanism
US6478532B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1999 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Nov 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aligner is disclosed including a buffer mechanism having a buffer paddle on which wafers may be buffered to increase the throughput of the aligner. The aligner is provided in general to identify a position of a notch, position and read the associated indicial mark and determine the radial runout of the wafer. The aligner includes a rotating support platform in the form of a chuck on which the wafers are received from the robot. A motor rotates the chuck so that the radial runout and notch of the wafer may be identified. According to the present invention, the aligner further includes a buffer mechanism having a buffer paddle and a drive mechanism for vertically translating the buffer paddle. The aligner further includes an analog sensor for determining the notch location, the radial runout and/or the position of the indicial mark on a wafer being rotated on the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.