Manufacture of multi-layered board with a unique resin system
US6479127B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31989
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to the manufacture of a multi-layered board having a stable, and moisture-resistant surface. To accomplish this and other advantages of the invention, an improved binder system is used in the production of the surface layers of a multi-layered board which combines an. excellent resin penetration inside the wood constituents of the board's surface layers, with a strength, durability and resistance to ambient water and moisture. The improved binder system used in the production of the board surface layers according to this invention involves contacting wood pieces with a binder composition comprised of a curable powdery aldehyde resin and a curable isocyanate resin in the substantial absence of free water to provide a composite mixture that can be formed into a surface layer for assembly and lamination together with other wood and resin composite layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.