Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning
US6479311B1 · kind B1 · utility
4Cited by
15References
20Claims
0Family size
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Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Nov 27, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.