Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step
US6479315B1 · kind B1 · utility
9Cited by
15References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Dec 2, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/056
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.