Resin composition
US6479578B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2001 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | May 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0373
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition which gives a molded article having both of excellent mechanical properties and abrasion resistance with maintaining excellent thermal resistance, chemical resistance, surface characteristics (non-sticking property, low friction property), electric insulating property, etc. of a fluorine-containing polymer; a molded article obtained from the resin composition; and a method for producing the molded article are provided. The resin composition comprises:(A-1) a fluorine-containing ethylenic polymer prepared by copolymerizing at least one of fluorine-containing monomers having any one of hydroxyl, carboxyl, a carboxylate salt group, a carboxylate ester group or epoxy in an amount of 0.05 to 30% by mole on the basis of the total amount of monomers, and(B-1) an inorganic filler or a non-meltable organic filler,wherein said resin composition comprises 1 to 99.5% by weight of the component (A-1) and 0.5 to 99% by weight of the component (B-1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.