Submount, electronic assembly and process for producing the same

US6479759B2 · kind B2 · utility

Assignee

• ALCATEL · FR

Inventors

• Dieter Ferling · Stuttgart, DE
• Anca Gutu-Nelle · Stuttgart, DE

Key dates

• Filing date: Jul 18, 2001
• Grant date: Nov 12, 2002
• Expiry date: Jul 18, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Electronic components, in particular opto-electronic components, are conventionally mounted onto a submount, on the surface of which there are located contact areas for the electrical contacting of the components. A so-called crosstalk may arise between two components. This interference effect clearly reduces the signal/interference ratio of the message signals and hence the performance of the assembly. Here it is proposed to introduce into the submount (1), at least beneath the point at which the first contact area (5) is located, a depression (8) which is provided with a metal film (6a) and filled with a dielectric, the metal film (6a) being electrically connected to the second, opposite-pole contact area (6). Hence the field lines are concentrated in the depression which is filled with the dielectric, whereby the metal film which is applied there shields the material of the submount against penetration of the field lines. The creation of a depression has the advantage that the overall height of the new arrangement is preserved in comparison with a traditional arrangement.