CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART
US6479763B1 · kind B1 · utility
23Cited by
13References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2000 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Apr 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249972
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive paste containing: conductive particles; foamable material which foams at the time of heating or decompression; and resin; characterized in that even after foaming of the foamable material, conductivity is maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.