Via structure with dual current path
US6479764B1 · kind B1 · utility
37Cited by
5References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2000 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | May 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a via for use in a printed circuit board or integrated circuit having first, second, third, and fourth layers. The via includes a first path capable of transmitting a forward current from the first to the second layer and a second path capable of transmitting a return current resulting from the forward current from the third to the fourth layer to return to a source of the forward current.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.