Method and apparatus of making a hole in a printed circuit board
US6479788B1 · kind B1 · utility
24Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2000 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | May 25, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/389
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a method and an apparatus of making a hole in a printed circuit board, which improve the quality of a hole shape and the processing speed. In accordance with the invention, a control apparatus controls a laser oscillator and a galvano mirrors so as to form a hole while gradually reducing a pulse width in each step with respect to one hole. As a result of this, no insulating material is left on the bottom portion of the hole, and it is possible to make a hole having an intended shape, particularly, having a desired diameter of the hole bottom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.