High performance air cooled heat sinks used in high density packaging applications
US6479895B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2001 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | May 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends upwardly from the upper surface of the post where possible to allow components mounted on a printed circuit board to be positioned around the integrated circuit device. The heat exchange portion including the array has a chamber within to receive and house an air movement device so that the air introduced around the fins by the air movement device enhances the heat dissipation from the heat dissipation device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.