Resonating apparatus in a dielectric substrate
US6480078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2001 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Aug 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P7/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A resonating apparatus includes a dielectric resonator on a dielectric supporting substrate, a fluid dielectric membrane which overspreads the dielectric resonator, and a microstrip line which is arranged in the fluid substrate membrane so that it is coupled with the dielectric resonator. The resonating apparatus reduces the conductivity loss by lengthening the distance between the dielectric supporting substrate in the higher layer and the microstrip line in the lower layer when it is used in a multi-layer circuit such as an MMIC. Further, the resonating apparatus increases the dielectric permittivity by using the dielectric resonator which has high dielectric permittivity as well as the fluid dielectric membrane. In this way, the resonating apparatus obtains high Q.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.