System for receiving and retaining a substrate

US6480369B1 · kind B1 · utility

Assignee

• Leica Microsystems Lithography · DE

Inventors

• Ulf-Carsten Kirschstein · Jena, DE
• Stefan Risse · Jena, DE
• Christoph Damm · Jena, DE
• Thomas Peschel · Jena, DE

Key dates

• Filing date: Oct 4, 2000
• Grant date: Nov 12, 2002
• Expiry date: Oct 4, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6833
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention refers to a receiving and supporting system for a substrate (17) in an exposure system, which is provided with a handling system for the supply of the substrate (17), with an electrostatic chuck arrangement (1) moveable in X, Y coordinates, for the support of the substrate (17) during the exposure, and with an exposure optic, from which a right angled particle radiation, in Z-direction is directed toward the substrate surface.In regard to the respective supporting system, at least a second electrostatic chuck arrangement (6) is provided, which—similar to the first chuck arrangement (1), for the support of the substrate (17) during the exposure, provides a bearing surface for the substrate, whereby the bearing surface of this second chuck arrangement (6) is positioned movable in Z coordinate. In regard to their supporting force, both chuck arrangements (1, 6) are arranged in such a manner, that the substrate (17) is securely positioned when being supported either on the first chuck arrangement (1) or when being supported exclusively on the second chuck arrangement (6).