Electronic component cooling apparatus
US6480383B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2001 |
| Grant date | Nov 12, 2002 |
| Priority date | — |
| Expiry date | Sep 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component cooling apparatus capable of firmly mounting a fan unit mounting frame on a heat sink without increasing mechanical strength of the fan unit mounting frame. The fan unit mounting frame includes a pair of mounting legs provided thereon with hooks, which are engaged with hook engagements provided on a base of the heat sink. A top plate of the fan unit mounting frame is provided thereon with projections acting as a first pivotal movement preventing engagement structure and fitted in gaps defined between adjacent radiation fins of a radiation fin unit. Also, the top plate is provided thereon with projections which are abutted against end surfaces of the radiation fins positioned in a second direction, to thereby act as a second pivotal movement preventing engagement structure for preventing pivotal movement of the top plate in the second direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.