Patent · US Expired

Device for cooling diode lasers

US6480514B1 · kind B1 · utility

22Cited by
2References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 20, 2000
Grant dateNov 12, 2002
Priority date
Expiry dateApr 12, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/4025
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

In a device for cooling diode lasers, it is aimed to increase the heat transfer coefficient, with a low overall height of the device, in such a manner that the pressure losses occurring also effectively ensure that stacked heat sinks are operated in parallel in terms of flow. Channels arranged in superimposed planes are divided, in each plane, into groups which are flow-connected in series and, in order to be connected in series, open out into flow-connecting links which are common to the superimposed planes. The device is suitable as a heat sink for diode lasers, in particular for cooling diode laser arrays and stacks thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.