Method of manufacturing chip PTC thermistor
US6481094B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2000 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Apr 21, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49787
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a chip PTC thermistor utilizes a piece of conductive polymer having a PTC characteristic and metal foils formed by patterning and provided on the upper and the lower sides of the piece under pressure integrally into a sheet, making a hole part in the sheet, applying a protective coating serving as plating resist to upper and lower sides of the sheet, forming an electrode on the sheet by electroplating, and cutting the sheet into a chip. The protective coating is made of a material applicable at a temperature equal to or lower than the melting point of the conductive polymer. The processing temperatures at the step from the step of making a hole part in the sheet to the pre-processing step of the step of forming an electrode by electroplating on the sheet are not above the melting point of the conductive polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.