Cooling apparatus based on heat energy bound to working fluid in phase transition
US6481491B2 · kind B2 · utility
3Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1999 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Nov 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention relates to a device for removing heat from an electronic component mounted on a circuit board. The device uses a working fluid circulated through cooling elements which are integrated into a metal matrix composite structure. The cooling elements are positioned and arranged within the structure to efficiently manage heat dissipation by evacuating the heat from the component in a multi-directional manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.