Heat dissipation system for high power LED lighting system
US6481874B2 · kind B2 · utility
99Cited by
9References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2001 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Mar 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high power LED lamp device includes a high power LED, a die for supplying electrical power to the LED, a heat sink secured to the die, and a housing between the heat sink and an external environment. Heat within the die is conducted to the heat sink. The housing conducts the heat received from the heat sink to the external environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.