Transcribing method
US6482279B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2001 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | May 16, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In the manufacturing process of recording media by transcribing information signals formed on a stamper onto the substrate, high-quality transcriptions must be achieved without causing any thermal deformations or warps. To this end, when the convexconcaves formed on a main surface of the stamper representing information signals are transcribed onto the substrate, a main surface of said substrate and a main surface of said stamper where the convexconcaves are formed are brought into contact facing each other, and said substrate and said stamper are pressurized with a prescribed pressure as they remain in contact, and in addition the temperature of only the contact surface layer of said substrate with said stamper is raised.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.