Adhesive for lamination
US6482523B1 · kind B1 · utility
9Cited by
12References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1999 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Mar 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31605
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive for lamination which comprises a resin whose dynamic wettability to a film substrate is at least 0.20 mN alone or in combination with a polyisocyanate curing agent, said adhesive for lamination having a good adhesiveness to a film substrate such as a plastic film, a metal foil, a metallized film or paper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.