Heat-relaxable substrates and arrays
US6482638B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2000 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Nov 8, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC40B60/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Articles, such as high density arrays, on heat-relaxable substrates that can be relaxed by exposure to thermal energy are disclosed, along with methods of manufacturing the arrays, and systems/apparatus for relaxing arrays using electromagnetic energy. The arrays may themselves include electromagnetic energy sensitive material in their construction, in which case exposure of the arrays to suitable electromagnetic energy can provide the thermal energy required to cause the arrays to relax. In other embodiments, the arrays may not include an electromagnetic energy sensitive material in their construction, in which case the arrays may be heated indirectly, i.e., by locating the arrays within a system or apparatus that includes an electromagnetic energy sensitive material and transferring the thermal energy from the electromagnetic energy sensitive material to the array by, e.g., conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.