Method of positioning a workpiece for optimal processing
US6483076B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2000 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | May 2, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/50151
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of producing a workpiece involves positioning the workpiece at a current processing position indicated by a hard-coded part program and then collecting position data which defines the positional arrangement of a current target area of the workpiece. The collected position data is processed by comparing it to reference position information that represents the positional arrangement of the same target area in an ideal workpiece employed in the development of the part program. The position of the workpiece (and hence the target area) is adjusted in accordance with the comparison results. A laser shock processing operation is performed on the workpiece at the current target area following the position adjustment step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.