Connecting device for power semiconductor modules with compensation for mechanical stresses
US6483128B2 · kind B2 · utility
7Cited by
11References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2001 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Feb 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/5216
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A connecting device for power semiconductor modules with compensation for mechanical stresses includes a sleeve connected to a substrate and having a region with a given very small diameter. A wire pin is provided for insertion into the region of the sleeve during operation to form an electrical connection for a board. The wire pin has a diameter greater than the given diameter for clamping the wire pin upon insertion in the region. Axial freedom of movement of the wire pin in the sleeve makes it possible to avoid mechanical stresses resulting from different material characteristics when a temperature change takes place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.