Micromechanical enclosure

US6483160B2 · kind B2 · utility

Assignees

• Daimlerchrysler AG · US
• Temic Telefunken Microelectronik · DE

Inventors

• Albert Engelhardt · Munich, DE
• Bernhard Hartmann · Birkenfeld, DE
• Ulrich Prechtel · Munich, DE
• Helmut Seidel · Starnberg, DE

Key dates

• Filing date: Jul 19, 2001
• Grant date: Nov 19, 2002
• Expiry date: Jul 19, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micromechanical enclosure suitable for micromechanical sensors, particularly acceleration sensors in the field of automotive vehicles, includes a micromechanical structure on a substrate, a conductor track layer connected to the micromechanical structure on the main surface of the substrate, a cover that covers a part of the main surface of the substrate, and a level compensation layer arranged next to the conductor track layer beneath the contact area during the manufacture of the wafer. A planarizing layer, which forms a level surface, may additionally be applied above this, to form a level area on the substrate which can easily be joined to a level area of the cover by means of a metallic wafer bond. This achieves small overall dimensions and avoids a glass frit bond.