Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US6483707B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2001 |
| Grant date | Nov 19, 2002 |
| Priority date | — |
| Expiry date | Jun 7, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heat sink and electrically non-conducting thermal interface having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The base plate is attachable to a heat-dissipating component, and may optionally include a ground contact connection for use with components that are not already grounded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.