Bonding process
US6485130B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Apr 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2457
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a process for bonding a first article to a second article which comprises (a) providing a first article comprising a polymer having photosensitivity-imparting substituents; (b) providing a second article comprising metal, plasma nitride, silicon, or glass; (c) applying to at least one of the first article and the second article an adhesion promoter selected from silanes, titanates, or zirconates having (i) alkoxy, aryloxy, or arylalkyloxy functional groups and (ii) functional groups including at least one photosensitive aliphatic >C═C< linkage; (d) placing the first article in contact with the second article; and (e) exposing the first article, second article, and adhesion promoter to radiation, thereby bonding the first article to the second article with the adhesion promote. In one embodiment of the present invention, the adhesion promoter is employed in microelectrical mechanical systems such as thermal ink jet printheads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.