BGA socket with improved contacts
US6485313B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Dec 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/41
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A BGA socket (1) comprises a base (20) defining a plurality of contact passageways (21), a plurality of contacts (30) received in the contact passageways, and a cover (10) movably mounted on the base. Each contact has a fitting portion (31) fixedly engaging with the base, a contact portion (32) formed above the fitting portion for engaging with a pin of an IC module, and a contact pad (33) below the fitting portion for being soldered to a printed circuit board. The bottom surface (331) of the contact pad has a plurality of bumps (332). A solder ball (34) is soldered to the bottom surface of the contact pad and bonded with the bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.