EMI shielding enclosures
US6485595B1 · kind B1 · utility
75Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2000 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | May 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2475
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.