Wiring arrangements having electrically conductive cross connections and method for producing same
US6485999B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Jan 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (0) and the bottom part (U) of the substrate (S1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.