Light sensing system with high pixel fill factor
US6486522B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1999 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Sep 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/80
Abstract
The invention is an imaging device having a high fill factor. The high fill factor is achieved by constructing the light sensors in a vertical fashion in the imaging device. The control circuitry of the light sensor is then contained inside the integrated circuit chip, rather than taking up area that could otherwise be used for light collection. The majority of the area on the surface of the IC chip is made up of light sensing elements, since the control circuitry is embedded in the IC chip. The control circuitry is connected to the light sensing devices through vias in the IC chip. The control circuitry of the chip is mainly contained within the die, rather than on it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.