Semiconductor module and power converting apparatus using the module
US6486548B1 · kind B1 · utility
13Cited by
2References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 20, 2000 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Apr 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor element mounted thereon by an adhesive, and the like in a similar manner as the module case. According to the present invention, an electrode can be disposed in an appropriate position in the semiconductor module, and the scope of the free layout is enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.