Cooling system for electronic device
US6487074B1 · kind B1 · utility
15Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Aug 2, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for an electronic device including a heat generating component within a case, wherein the heat generating component is installed on a bottom plate of the case, the bottom plate has a ventilating hole for air passage formed therein, and a foot portion installed outer surface of the case for maintaining a prescribed vertically opened space below the lower surface of the case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.