Compact heat sink module
US6487076B1 · kind B1 · utility
26Cited by
7References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 1, 2001 |
| Grant date | Nov 26, 2002 |
| Priority date | — |
| Expiry date | Oct 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A compact heat sink module is able to provide a compact heat sink for installation in a notebook computer. Furthermore the heat sink module has an effective cooling ability for keeping a normal operation temperature of a CPU by multiple conductors conducting heat from the CPU and a fan surrounded within the conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.