Method and apparatus for producing semiconductor element
US6488021B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Jan 6, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/0082
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for producing a semiconductor element comprises the steps of: forming a plurality of grooves on a first surface of a semiconductor multi-layer structure along a first direction: forming a plurality of multi-element bars by cleaving the semiconductor multi-layer structure along a second direction; placing at least one of the plurality of multi-element bars on a support stage; and cleaving the at least one of the plurality of multi-element bars along the plurality of grooves by moving a pressure member in a longitudinal direction of the at least one of the plurality of multi-element bars while a constant load is applied by the pressure member to a second surface of the at least one of the plurality of multi-element bars, the second surface being opposite a third surface corresponding to the first surface of the at least one of the plurality of multi-element bars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.