Patent · US Expired

Method for improving the manufacturing safety of weld joints

US6488199B1 · kind B1 · utility

2Cited by

9References

13Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jürgen Schwaiger · Reutlingen, DE
Rolf Becker · Rheydt, DE

Key dates

Filing date	Dec 29, 2000
Grant date	Dec 3, 2002
Priority date	—
Expiry date	Dec 29, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for increasing the manufacturing certainty of soldered connections between a ceramic carrier and a printed-circuit board. It includes the method step of applying a first decomposition-resistant metallization layer on a ceramic carrier and the subsequent imprinting onto the first metallizing layer of a second metallizing layer, improving the wetting performance. In this manner, it is possible to achieve an increase in the overall metallizing layer thickness in the edge area of a soldered connection, whose solder rise in turn makes possible an optical, fully-automatic monitoring of the soldered connection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.