Coupling for microcomponents
US6488315B1 · kind B1 · utility
6Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Apr 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87885
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A coupling for microcomponents has several essentially plane-parallel plates with line connections for delivering and discharging liquid or gaseous components. The line connections are mounted on a connection block which protrudes through openings in the plates with fixing segments that engage a pressure plate retained by a clip. The line connections open out in an area of line bores in the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.