Printed circuit board for RAMBUS
US6489012B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Oct 20, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board for high speed processing devices such as RAMBUS is disclosed. Adhesive means are interposed between a plurality of both-face copper clad laminates, and each of the adhesive means consists of a clad laminate and prepreg layers formed on both faces of the clad laminate. The sum total of the thicknesses of the clad laminates and the prepreg layers is smaller than that of the conventional printed circuit board. Therefore, when carrying out a pressing to attach the copper foils, the thickness deviations are decreased compared with the conventional case, and therefore, the occurrence of impedance defects can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.