Applying resistive layer onto copper
US6489035B1 · kind B1 · utility
13Cited by
32References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Jul 31, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12472
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 å and about 70 å. A vapor deposited resistive material is provided on the stabilization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.