Epoxy resin formulation containing epoxy group-terminated polyesters
US6489405B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 18, 1995 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Dec 18, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable epoxy resin formulation comprisinga) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester,b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional componentsc) a curing accelerator, andd) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.