Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding process
US6489573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2001 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Jun 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09709
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrode bonding structure is disclosed for reducing the thermal expansion of a circuit board during the bonding process of the circuit board and a substrate of a flat display. The electrode bonding structure includes a substrate, a circuit board, and an anisotropic conductive film ACF. A substrate dielectric layer and an indenting pad are formed on the surface of the substrate, and the inner surface of the indenting pad is lower than the surface of the substrate dielectric layer by an indenting depth H3. The circuit board is placed parallel to the substrate, and a circuit dielectric layer and a bump pad are formed on the surface of the circuit board. The bump pad is higher than the surface of the circuit dielectric layer by a height H1. The ACF is placed between the substrate and the circuit board, and the thickness of the ACF is a thickness H2. The position of the indenting pad is corresponded to that of the bump pad, and the height H1 is not less than the sum of the thickness H2 and the depth H3, that is, H1>=H2+H3. The thermal expansion of the circuit board can be reduced during the bonding process of the substrate and the circuit board and the quality of the display can al…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.