Semiconductor device and method for manufacturing the same
US6489668B1 · kind B1 · utility
13Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1999 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | May 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is a semiconductor device which can improve the adhesive force between a semiconductor chip substrate. This semiconductor device 60 has a semiconductor chip 18, a die pad (metallic portion) 16 on which the semiconductor chip 18 is fixedly mounted and supported through an adhesive layer 62, and a sealing resin 24 for sealing the die pad 16 and semiconductor chip 18. The adhesive layer 62 includes a plurality of conductive adhesive regions 66 and a plurality of insulative adhesive regions 64 together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.