Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
US6489676B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2001 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Apr 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises: a semiconductor element; an external terminal used for an external connection; an interposer having the semiconductor element mounted on a first surface thereof and having the external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect the semiconductor element and the external terminal; a resin sealing the semiconductor element on the first surface; and an interconnecting portion formed within the resin, the interconnecting portion having a first connecting part electrically connected to the external terminal and having a second connecting part exposed on an outer surface of the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.